![[Oct. 19, 2026] Weekly News](https://www.kfab3d.com/data/file/news/thumb-3530929278_fZyPmAHw_37766ff7e31175656c0fd853b2e43a67f7fe1a16_480x270.jpg)
[Oct. 19, 2026] Weekly News
![[Oct. 12, 2026] Weekly News](https://www.kfab3d.com/data/file/news/thumb-3530929278_hGNsprm8_5863bd3846dd7156ec8f7c14593fc00bd5025e86_480x270.jpg)
[Oct. 12, 2026] Weekly News
![[Oct. 9, 2026] GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging](https://www.kfab3d.com/data/file/news/thumb-3698871488_McZEy4Yf_ba57ae0dbe8ff5836aef3f14c5c2568c786780bb_480x270.png)
[Oct. 9, 2026] GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging
![[Oct. 7, 2026] The Data Center Is Moving to 800V: Microchip and Navitas Are Enabling the Transition](https://www.kfab3d.com/data/file/news/thumb-3698871488_VKCoPIXy_69c58ff68a6811e67d3f9c43ab8d1aacd0bc7d8e_480x270.jpg)
[Oct. 7, 2026] The Data Center Is Moving to 800V: Microchip and Navitas Are Enabling the Transition
![[Oct. 7, 2026] Infineon Leads the Quiet Migration of Power Semiconductors](https://www.kfab3d.com/data/file/news/thumb-3698871488_P0Ym2CdK_c625d686a5b940b77ec8b32182d8bf91e2d9d634_480x270.jpg)
[Oct. 7, 2026] Infineon Leads the Quiet Migration of Power Semiconductors
![[Oct. 7, 2026] Huawei's Kirin 9050 Pro reveals new logic folding chip design](https://www.kfab3d.com/data/file/news/thumb-3698871488_OBwL8HJe_ba19a1e4d347aaa9ed69435212f97ba06ee9e8d2_480x270.jpg)
[Oct. 7, 2026] Huawei's Kirin 9050 Pro reveals new logic folding chip design
![[Oct. 5, 2026] Weekly News](https://www.kfab3d.com/data/file/news/thumb-3530929278_fmoSaHrM_84b2e602f205c7cb497f1ec458439b7743d7afcc_480x270.jpg)
[Oct. 5, 2026] Weekly News
![[Sep. 29, 2026] VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore](https://www.kfab3d.com/data/file/news/thumb-2034375786_W2zKUG0x_4d2ae3e2c6c5a34f846c77bde3c751f10ae7d25f_480x270.jpg)
[Sep. 29, 2026] VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore
![[Sep. 28, 2026] Weekly News](https://www.kfab3d.com/data/file/news/thumb-3530929278_thmTFpUi_55d1345f6edc5fde84664d9a79250cdb74f2f717_480x270.png)
[Sep. 28, 2026] Weekly News
![[Sep. 21, 2026] Weekly News](https://www.kfab3d.com/data/file/news/thumb-3530929278_cJbakdSv_d45da3c3955667ca42ece1b389d9c0c97ec36d4e_480x270.jpg)
[Sep. 21, 2026] Weekly News
![[Sep. 17, 2026] onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era](https://www.kfab3d.com/data/file/news/thumb-3698871488_xgyCfTAq_698df516be912052f1513e5ced547f1ea563bf1f_480x270.jpg)
[Sep. 17, 2026] onsemi Introduces the Embedded Power Platform, a Breakthrough Architecture for the AI Era
Geekerwan의 분해분석과 Kurnal Insights의 다이 사진을 종합한 DIGITIMES 후속 보도는 Mate 90 Pro Max용 SoC가 전통적인 단일평면 다이가 아니라 두 개의 다이를 수직 적층한 구조라고 분석했습니다. 다만 Cu-Cu 본딩 방식, TSV 수, 다이별 기능분할과 공정노드는 Huawei가 공식 공개한 사양이 아닙니다.
