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3D Integrated Power Delivery

We provide advanced on-chip and in-package 3D power management solutions featuring high-aspect-ratio passive devices and innovative thermal management architectures. Our solutions achieve ultra-high capacitance density, reduced parasitic effects (ESL/ESR), and efficient thermal performance to support reliable power delivery for next-generation HPC and AI systems.

3D Interconnect

We develop high-density, low-loss 3D interconnect solutions for heterogeneous integration, multi-chiplet packaging, and large-scale chip architectures. Our technology enables ultra-fast on-chip interconnects for reticle-size and wafer-scale systems while ensuring excellent signal integrity (SI) and power integrity (PI) across high-density I/O networks for next-generation AI and HPC platforms.

3D Memory

We develop next-generation high-density, low-latency 3D memory solutions to overcome the memory wall in AI computing, data centers, and edge systems. Our technology advances 3D DRAM, 3D NOR architectures, and Universal Memory, delivering exceptional energy efficiency, ultra-high bandwidth, and seamless integration between logic and memory.

3D Fabrication

We provide specialized 3D semiconductor process design, integration, and foundry management services for advanced 3D nanostructures and microelectronic devices. By collaborating with a network of specialized foundry and equipment partners, we deliver optimized process flows, precision HAR patterning, and wafer-scale fabrication tailored to customers' custom 3D architectures.

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