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[Oct. 9, 2026] GlobalFoundries reaches agreement to establish U.S.-bas…
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GlobalFoundries는 TSMC와 20억달러 규모의 5년 계약을 체결하고 뉴욕 몰타 공장에 CoWoS용 실리콘 인터포저 생산능력을 구축합니다. 내장형 딥트렌치 커패시터 부품도 포함되며, 2028년 상반기부터 양산을 확대해 미국 최초의 CoWoS 실리콘 인터포저 공급원이 된다는 계획입니다.
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[Nov. 2, 2026] Weekly News
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[Oct. 26, 2026] Weekly News
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[Oct. 24, 2026] Stacked-Die Multi-Chip Architectures: The Tradeoff Between Scaling And Power Delivery
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[Oct. 19, 2026] Weekly News
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[Oct. 12, 2026] Weekly News
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![[Oct. 9, 2026] GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging](https://www.kfab3d.com/data/file/news/thumb-3698871488_McZEy4Yf_ba57ae0dbe8ff5836aef3f14c5c2568c786780bb_480x270.png)
[Oct. 9, 2026] GlobalFoundries reaches agreement to establish U.S.-based supply of silicon interposers for advanced AI packaging
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![[Oct. 7, 2026] The Data Center Is Moving to 800V: Microchip and Navitas Are Enabling the Transition](https://www.kfab3d.com/data/file/news/thumb-3698871488_VKCoPIXy_69c58ff68a6811e67d3f9c43ab8d1aacd0bc7d8e_480x270.jpg)
[Oct. 7, 2026] The Data Center Is Moving to 800V: Microchip and Navitas Are Enabling the Transition
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![[Oct. 7, 2026] Infineon Leads the Quiet Migration of Power Semiconductors](https://www.kfab3d.com/data/file/news/thumb-3698871488_P0Ym2CdK_c625d686a5b940b77ec8b32182d8bf91e2d9d634_480x270.jpg)
[Oct. 7, 2026] Infineon Leads the Quiet Migration of Power Semiconductors
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[Oct. 7, 2026] Huawei's Kirin 9050 Pro reveals new logic folding chip design
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[Oct. 5, 2026] Weekly News
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[Sep. 29, 2026] VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore
