![[August 5, 2026] SK하이닉스, 샌디스크와 HBF 첫 표준 규격 공개…‘FMS 2026’서 AI 메모리 해법 알린다](https://www.kfab3d.com/data/file/news/thumb-3554136725_yznp6v85_6c829ce18d51a7d2824e570ca60eb22364e90f0b_480x270.jpg)
![[August 5, 2026] 삼성전자, FMS 2026서 차세대 3D 메모리 비전 제시](https://www.kfab3d.com/data/file/news/thumb-3554136725_rGfKbxUs_e6b8603e9e4471a9d0a3ac7731650c23927e82ab_480x270.jpg)
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페이지 정보
[August 3, 2026] Weekly News
본문
1. 3D Memory
Samsung, SK hynix Reportedly Reconsider Hybrid Bonding Timeline; 16-High HBM4E May Be Earliest Adoption
2. 3D Logic
VLSI 2026: Intel 18A Platform Momentum From Devices To Routed Designs
3. 3D Packaging
Engineering Heterogeneity at Scale
4. 3D Power & Thermal
CEA-Leti Pushes Stacking Roadmap as AI Runs Into Memory and Power Limits
5. 3D Process & Metrology
Metrology Digs Deep To Produce Next-Generation 3D NAND
- 이전자료[August 5, 2026] 삼성전자, FMS 2026서 차세대 3D 메모리 비전 제시 26.08.05
