3D Interconnect 3D 배선
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We develop high-density, low-loss 3D interconnect solutions for heterogeneous integration, multi-chiplet packaging, and large-scale chip architectures. Our technology enables ultra-fast on-chip interconnects for reticle-size and wafer-scale systems while ensuring excellent signal integrity (SI) and power integrity (PI) across high-density I/O networks for next-generation AI and HPC platforms.
